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OPA4170AID - Texas Instruments

Description: Texas Instruments OPA4170AID, Quad Low Power Op Amp, 1.2MHz Rail-Rail, 2.7 → 36 V, 14-Pin SOIC

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OPA4170AID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D(R-DPSO-G14)
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OPA4170AID - Texas Instruments  - 3D model - Small Outline Packages - D(R-DPSO-G14)
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OPA4170AID Details

  • Manufacturer Part Number:

    OPA4170AID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0035 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000015 µA

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    8.65 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.58 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA4170AID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of OPA4170AID is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, make sure to follow the recommended layout and grounding practices, use a low-ESR capacitor for decoupling, and avoid capacitive loads. Additionally, consider adding a noise filter or a Zobel network to reduce oscillations.
  • The recommended input impedance is 1kΩ to 10kΩ, and the recommended output impedance is 500Ω to 1kΩ. However, the optimal impedance values may vary depending on the specific application and circuit requirements.
  • Yes, OPA4170AID can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance, and the output impedance is matched to the load impedance to maintain signal integrity.
  • To minimize EMI and RFI, use a shielded enclosure, keep the circuit layout compact, and use a common-mode choke or a ferrite bead to filter out high-frequency noise. Additionally, consider adding EMI filters or shielding to the input and output lines.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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