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OPA4353EA/250 - Texas Instruments

Description: Quad high-speed, single-supply, rail-to-rail operational amplifiers MicroAmplifier™ series<

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OPA4353EA/250 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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OPA4353EA/250 - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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OPA4353EA/250 Details

  • Manufacturer Part Number:

    OPA4353EA/250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    22 V/us

  • Supply Current-Max:

    32 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    44000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA4353EA/250 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA4353EA/250 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, use a gain resistor (Rg) that is less than or equal to 1 kΩ, and a feedback capacitor (Cf) that is greater than or equal to 10 pF. Additionally, ensure that the output impedance of the previous stage is low enough to drive the input of the OPA4353EA/250.
  • The maximum power dissipation of OPA4353EA/250 is 1.4 W. However, this can be limited by the thermal resistance of the package and the ambient temperature. It's essential to calculate the power dissipation and ensure it's within the safe operating area.
  • Yes, OPA4353EA/250 is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C.
  • To protect OPA4353EA/250 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, use a low-pass filter or a shielded cable to reduce radiated emissions.

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OPA4353EA/250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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