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OPA547F/500G3 - Texas Instruments

Description: TEXAS INSTRUMENTS - OPA547F/500G3 . - OP AMP, HIGH VOLT, SMD, PFM-7, 547

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OPA547F/500G3 - Texas Instruments PCB footprint - Other - Other - KTW (R-PSFM-G7)
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OPA547F/500G3 - Texas Instruments  - 3D model - Other - KTW (R-PSFM-G7)
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OPA547F/500G3 Details

  • Manufacturer Part Number:

    OPA547F/500G3

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK

  • Package Description:

    GREEN, PLASTIC, DDPAK-7

  • Pin Count:

    7

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.5 µA

  • Bias Current-Max (IIB) @25C:

    0.5 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.05 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PSSO-G7

  • JESD-609 Code:

    e3

  • Length:

    10.095 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -30 V

  • Neg Supply Voltage-Nom (Vsup):

    -30 V

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-263

  • Package Equivalence Code:

    SMSIP7H,.55,50TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    YES

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.955 mm

  • Slew Rate-Nom:

    6 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    15 mA

  • Supply Voltage Limit-Max:

    30 V

  • Supply Voltage-Nom (Vsup):

    30 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    8.89 mm

OPA547F/500G3 Frequently Asked Questions (FAQs)

  • A good PCB layout for the OPA547F involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The output capacitor should be chosen based on the desired closed-loop bandwidth and stability. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF. A larger capacitor value can improve stability but may reduce the bandwidth.
  • The maximum power dissipation of the OPA547F is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated based on the actual operating conditions.
  • Yes, the OPA547F can be used as a unity-gain buffer. However, it's essential to ensure that the input signal is within the common-mode range of the device and that the output is not overloaded. Additionally, the gain bandwidth product of the device should be considered to ensure stability.
  • To protect the OPA547F from overvoltage and ESD, it's recommended to use voltage clamps, such as TVS diodes, and ESD protection devices, such as ESD arrays, at the input and output pins. Additionally, following proper PCB design and layout practices, such as using a solid ground plane and minimizing trace lengths, can also help reduce the risk of damage.

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OPA547F/500G3 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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