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OPA551UA/2K5E4 - Texas Instruments

Description: Operational Amplifiers General Purpose 1 8V ~ 60V, ±4V ~ 30V 3MHz 15 V/us SOIC-8_150mil RoHS

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OPA551UA/2K5E4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G8)
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OPA551UA/2K5E4 - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G8)
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OPA551UA/2K5E4 Details

  • Manufacturer Part Number:

    OPA551UA/2K5E4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    92 dB

  • Common-mode Reject Ratio-Nom:

    102 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -30 V

  • Neg Supply Voltage-Nom (Vsup):

    -30 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    15 V/us

  • Supply Current-Max:

    10 mA

  • Supply Voltage Limit-Max:

    30 V

  • Supply Voltage-Nom (Vsup):

    30 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA551UA/2K5E4 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA551UA/2K5E4 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. TI provides a recommended layout in the datasheet and in application notes such as SLAA402.
  • The output capacitor should be chosen based on the desired closed-loop bandwidth and stability. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF. TI recommends using a capacitor with an ESR (Equivalent Series Resistance) of less than 5 ohms to ensure stability.
  • The maximum power dissipation of OPA551UA/2K5E4 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated for higher temperatures.
  • Yes, OPA551UA/2K5E4 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended operating conditions and derate the power dissipation accordingly.
  • To protect OPA551UA/2K5E4 from overvoltage and ESD, use voltage clamps or transient voltage suppressors (TVS) on the input and output pins. Additionally, follow proper handling and storage procedures to prevent ESD damage.

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OPA551UA/2K5E4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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