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OPA561PWP/2KG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps High current Op Amp Waiver required

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OPA561PWP/2KG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PWP(R-PDSO-G20)
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OPA561PWP/2KG4 - Texas Instruments  - 3D model - Small Outline Packages - PWP(R-PDSO-G20)
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OPA561PWP/2KG4 Details

  • Manufacturer Part Number:

    OPA561PWP/2KG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    HTSSOP-20

  • Pin Count:

    20

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0001 µA

  • Input Offset Voltage-Max:

    20000 µV

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    YES

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Slew Rate-Nom:

    50 V/us

  • Supply Current-Max:

    70 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    17000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    4.4 mm

OPA561PWP/2KG4 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA561PWP/2KG4 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, use a compensation capacitor (Cc) between the output and the inverting input, and a series resistor (Rs) in the feedback path. The values of Cc and Rs depend on the specific application and can be calculated using the datasheet equations.
  • The maximum power dissipation of OPA561PWP/2KG4 is 1.4W. However, this value can be limited by the thermal resistance of the package and the PCB, so it's essential to consider thermal management in the design.
  • Yes, OPA561PWP/2KG4 is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures, so it's essential to consider the thermal design and potential derating of the device.
  • To protect OPA561PWP/2KG4 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite beads on the input and output lines.

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OPA561PWP/2KG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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