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OPA607IDBVR - Texas Instruments

Description: Operational Amplifiers - Op Amps Low power, precision, 50 MHz decompensated CMOS operational amplifier for cost sensitive systems 5-SOT-23 -40 to 125

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PCB Footprints
OPA607IDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA607IDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA607IDBVR Details

  • Manufacturer Part Number:

    OPA607IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-03-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    94 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES (AVCL>=6)

  • Input Offset Current-Max (IIO):

    0.00002 µA

  • Input Offset Voltage-Max:

    600 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    24 V/us

  • Supply Current-Max:

    1 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    50000

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA607IDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA607IDBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes for guidance.
  • The maximum power dissipation of OPA607IDBVR is 1.4W. However, this can be limited by the thermal resistance of the package and the ambient temperature. It's essential to ensure proper heat sinking and thermal management to prevent overheating.
  • OPA607IDBVR is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consult the datasheet and application notes for guidance on using the device in high-temperature environments.
  • Oscillations or instability issues with OPA607IDBVR can be caused by poor PCB layout, inadequate decoupling, or incorrect gain resistor selection. Troubleshooting involves checking the PCB layout, decoupling, and gain resistors, and using tools like a spectrum analyzer to identify the source of the issue.

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OPA607IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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