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OPA607QDBVRQ1 - Texas Instruments

Description: High Speed Operational Amplifiers Automotive, 50-MHz, low-power, gain of 6-V/V stable, rail-to-rail output CMOS operational amplifier

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OPA607QDBVRQ1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV
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3D Models
OPA607QDBVRQ1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV
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OPA607QDBVRQ1 Details

  • Manufacturer Part Number:

    OPA607QDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bandwidth (3dB)-Nom:

    10 MHz

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    90 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES (AVCL>=6)

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    600 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    24 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn); Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    50000

  • Voltage Gain-Min:

    316227.766

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA607QDBVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA607QDBVRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, use a compensation capacitor (e.g., 10nF to 100nF) between the output and the inverting input. Also, ensure that the gain-setting resistors are of low tolerance (e.g., 1%) and that the layout is well-shielded to prevent electromagnetic interference.
  • The maximum power dissipation of OPA607QDBVRQ1 is 1.4W. However, this can be limited by the thermal resistance of the package and the PCB. Ensure good thermal design and heat sinking to prevent overheating.
  • While OPA607QDBVRQ1 is rated for operation up to 125°C, its performance may degrade at high temperatures. Ensure that the device is properly heat-sunk and that the operating temperature is within the recommended range for optimal performance.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite beads on the input and output lines to reduce EMI susceptibility.

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OPA607QDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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