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OPA657NB/250 - Texas Instruments

Description: 1.6GHz, Low-Noise, FET-Input OPERATIONAL AMPLIFIER

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PCB Footprints
OPA657NB/250 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV
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3D Models
OPA657NB/250 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV
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OPA657NB/250 Details

  • Manufacturer Part Number:

    OPA657NB/250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00125 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    83 dB

  • Common-mode Reject Ratio-Nom:

    89 dB

  • Frequency Compensation:

    YES (AVCL>=7)

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    700 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    16 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1600000

  • Voltage Gain-Min:

    1410

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA657NB/250 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA657NB/250 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes for guidance.
  • The maximum power dissipation of OPA657NB/250 is 1.4W. However, this can be limited by the thermal resistance of the package and the PCB. It's essential to ensure proper thermal management to prevent overheating.
  • Yes, OPA657NB/250 can be used in a single-supply configuration. However, the input common-mode range is limited to VCC-1.5V, and the output swing is reduced. Consult the datasheet and application notes for guidance on single-supply operation.
  • To filter out noise and oscillations, use a combination of decoupling capacitors, ferrite beads, and RC filters. Additionally, ensure that the PCB layout is optimized for noise reduction, and consider using shielding or guard rings around sensitive nodes.

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OPA657NB/250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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