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OPA693IDBVR - Texas Instruments

Description: Video Amplifiers Ultra-Widebnd Fixed Gain Video Buffer

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PCB Footprints
OPA693IDBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A
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3D Models
OPA693IDBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A
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OPA693IDBVR Details

  • Manufacturer Part Number:

    OPA693IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    45 µA

  • Bias Current-Max (IIB) @25C:

    45 µA

  • Input Offset Voltage-Max:

    2000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    70 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    2000 V/us

  • Slew Rate-Nom:

    2500 V/us

  • Supply Current-Max:

    13 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1400000

  • Width:

    1.6 mm

OPA693IDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA693IDBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. Additionally, it's recommended to use a low-ESR capacitor for the power supply bypassing.
  • To ensure stability in high-gain configurations, it's essential to follow the recommended compensation network values and layout guidelines. Additionally, consider using a lower gain or adding a feedback capacitor to reduce the phase shift and improve stability.
  • The maximum power dissipation of OPA693IDBVR is dependent on the ambient temperature and the thermal resistance of the package. The maximum power dissipation can be calculated using the formula: Pd = (TJ - TA) / θJA, where Pd is the power dissipation, TJ is the junction temperature, TA is the ambient temperature, and θJA is the thermal resistance.
  • OPA693IDBVR is specified to operate up to 125°C, but the device's performance and reliability may degrade at higher temperatures. It's essential to consider the device's thermal limitations and ensure proper heat sinking and cooling to maintain reliable operation.
  • To troubleshoot oscillations or instability issues, start by checking the PCB layout and ensuring that it follows the recommended guidelines. Next, verify that the power supply is clean and well-regulated, and that the input and output signals are properly terminated. If the issue persists, consider using a scope to analyze the signals and identify the source of the oscillation.

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OPA693IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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