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OPA703NA/250G4 - Texas Instruments

Description: CMOS, Rail-to-Rail, I/O OPERATIONAL AMPLIFIERS

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OPA703NA/250G4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV
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OPA703NA/250G4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV
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OPA703NA/250G4 Details

  • Manufacturer Part Number:

    OPA703NA/250G4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    750 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.6 V/us

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    63100

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA703NA/250G4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a solid ground plane, short traces, and minimal impedance mismatch to ensure high-frequency stability and low noise. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • TI recommends using ESD protection devices such as TVS diodes or ESD arrays at the input and output pins of the OPA703NA/250G4. Additionally, handling the device by the body or using an anti-static wrist strap can prevent ESD damage.
  • The maximum power dissipation of OPA703NA/250G4 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 500mW at 25°C. However, it's recommended to derate the power dissipation based on the operating temperature and thermal resistance.
  • The OPA703NA/250G4 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to consult the datasheet and application notes for guidance on high-temperature operation.
  • The OPA703NA/250G4 requires a dual supply voltage (±VCC) and a bias voltage (VREF) for proper operation. Ensure that the supply voltage is within the recommended range (±2.5V to ±18V) and the bias voltage is set to the recommended value (typically 0V or VCC/2).

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OPA703NA/250G4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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