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OPA735AIDBVTG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps 0.05uV/dgC Sngl-Sply CMOS 0-Drift Ser

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OPA735AIDBVTG4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A  HEIGHT 1.45
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OPA735AIDBVTG4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A  HEIGHT 1.45
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OPA735AIDBVTG4 Details

  • Manufacturer Part Number:

    OPA735AIDBVTG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    115 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0003 µA

  • Input Offset Voltage-Max:

    5 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    0.75 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1600

  • Voltage Gain-Min:

    562000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA735AIDBVTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the OPA735 datasheet, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The output capacitor should be chosen based on the desired output impedance, stability, and noise performance. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF, and a voltage rating that exceeds the maximum output voltage of the op-amp.
  • The maximum power dissipation of OPA735AIDBVTG4 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C, but this can be derated to 0.7W at 85°C.
  • Yes, OPA735AIDBVTG4 is rated for operation from -40°C to 125°C, making it suitable for high-temperature environments. However, the maximum power dissipation and other performance characteristics may be affected at higher temperatures.
  • To ensure EMC, follow proper PCB layout and design practices, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering components as needed. Additionally, ensure that the op-amp is properly bypassed and decoupled.

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OPA735AIDBVTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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