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OPA810IDBVR - Texas Instruments

Description: Operational Amplifiers - Op Amps Single Channel, High Performance, 27 V, 140 MHz, RRIO FET Input Op Amp 5-SOT-23 -40 to 125

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PCB Footprints
OPA810IDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA810IDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA810IDBVR Details

  • Manufacturer Part Number:

    OPA810IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2020-06-04

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00002 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00002 µA

  • Input Offset Voltage-Max:

    500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -14 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    200 V/us

  • Supply Current-Max:

    4.6 mA

  • Supply Voltage Limit-Max:

    14 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    70000

  • Voltage Gain-Min:

    251188

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA810IDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA810IDBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain and bandwidth. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes. Typically, a ratio of 1:1 to 10:1 for Rf:Rg is recommended.
  • The maximum power dissipation of OPA810IDBVR is 750mW. However, this can be limited by the thermal resistance of the package and the PCB. It's essential to ensure proper thermal management to prevent overheating.
  • OPA810IDBVR is specified to operate from -40°C to 125°C. However, the device's performance may degrade at higher temperatures. It's essential to consult the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To filter out noise and interference, use a combination of passive and active filtering techniques. Add bypass capacitors to the power supply lines, use a low-pass filter at the input, and consider adding a ferrite bead or common-mode choke to reduce electromagnetic interference.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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