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OPA810IDT - Texas Instruments

Description: Operational Amplifiers - Op Amps Single Channel, High Performance, 27 V, 140 MHz, RRIO FET Input Op Amp 8-SOIC -40 to 125

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OPA810IDT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A +
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OPA810IDT - Texas Instruments  - 3D model - Small Outline Packages - D0008A +
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OPA810IDT Details

  • Manufacturer Part Number:

    OPA810IDT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2019-11-07

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    20 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00002 µA

  • Input Offset Voltage-Max:

    500 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -14 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.23

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    200 V/us

  • Supply Current-Max:

    4.6 mA

  • Supply Voltage Limit-Max:

    14 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    70000

  • Voltage Gain-Min:

    251188.64

  • Wideband:

    NO

  • Width:

    3.895 mm

OPA810IDT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, it's recommended to use a thermal relief pattern on the PCB to improve heat dissipation.
  • The output capacitor should be chosen based on the desired closed-loop bandwidth and stability. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF, and a voltage rating that exceeds the maximum output voltage of the op-amp.
  • The maximum power dissipation of OPA810IDT is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C, but this can be derated to 0.7W at 85°C.
  • Yes, OPA810IDT can be used as a unity-gain buffer, but it's not recommended due to its high bandwidth and gain-bandwidth product. This can lead to oscillations and instability. Instead, consider using a dedicated unity-gain buffer op-amp like the OPA827.
  • To protect OPA810IDT from input overvoltage, consider using input clamping diodes or a voltage limiter circuit. Additionally, ensure that the input signal is within the recommended common-mode voltage range to prevent damage to the op-amp.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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