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OPA827AIDR - Texas Instruments

Description: Low-Noise, High-Precision, JFET-Input Operational Amplifier

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OPA827AIDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A height 1.75
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OPA827AIDR - Texas Instruments  - 3D model - Small Outline Packages - D0008A height 1.75
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OPA827AIDR Details

  • Manufacturer Part Number:

    OPA827AIDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.05 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    114 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    20 V/us

  • Slew Rate-Nom:

    28 V/us

  • Supply Current-Max:

    5.2 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    22000

  • Voltage Gain-Min:

    501000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA827AIDR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA827AIDR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper layout and decoupling techniques, and to use a gain resistor (RG) that is less than or equal to 1kΩ. Additionally, a capacitor (CF) in the range of 2pF to 10pF can be added in parallel with RG to improve stability.
  • The recommended input capacitance is 10pF to 100pF, and the recommended output capacitance is 10nF to 100nF. However, the optimal capacitance values may vary depending on the specific application and layout.
  • Yes, the OPA827AIDR can be used in a single-supply configuration. However, it's essential to ensure that the input common-mode voltage is within the specified range (VCC- to VCC+), and that the output voltage swing is within the specified range (VCC- to VCC+).
  • To reduce noise and EMI, use proper layout techniques, such as separating analog and digital grounds, using a solid ground plane, and minimizing trace lengths. Additionally, use shielding, filtering, and decoupling capacitors to reduce noise and EMI.

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OPA827AIDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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