SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Packing Method:
TUBE
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Seated Height-Max:
1.1 mm
Slew Rate-Nom:
150 V/us
Supply Current-Max:
7.9 mA
Supply Voltage Limit-Max:
20 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
YES
Technology:
BIPOLAR
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
45000
Voltage Gain-Min:
501187.2336
Wideband:
NO
Width:
3 mm
OPA828IDGNT Frequently Asked Questions (FAQs)
Texas Instruments recommends a layout with a solid ground plane, short traces, and minimal impedance mismatch to ensure optimal performance. A 4-layer PCB with a dedicated ground plane and power plane is recommended. Additionally, it's essential to follow good PCB design practices, such as keeping the input and output traces separate and avoiding vias under the device.
The OPA828IDGNT has a thermal pad that must be connected to a thermal relief pattern on the PCB to ensure proper heat dissipation. A thermal relief pattern with multiple vias connected to a solid ground plane is recommended. Additionally, the device should be mounted on a heat sink or a metal core PCB to further improve thermal dissipation.
The OPA828IDGNT requires a 50Ω input termination to ensure optimal performance. A 50Ω resistor in series with the input signal is recommended. For the output, a 50Ω back-termination resistor is recommended to minimize reflections and ensure signal integrity.
Yes, the OPA828IDGNT can be used in a non-inverting configuration. However, the input common-mode range is limited to VCC-1.5V to VCC+0.5V, so the input signal must be within this range to ensure proper operation. Additionally, the gain bandwidth product is reduced in non-inverting configurations, so the device may not achieve the same level of performance as in an inverting configuration.
The OPA828IDGNT is a sensitive device and requires ESD protection during handling and assembly. Texas Instruments recommends using anti-static wrist straps, mats, and packaging materials to prevent ESD damage. Additionally, the device should be handled in a controlled environment with humidity and temperature control to minimize the risk of ESD damage.
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OPA828IDGNT Overview
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
