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OPA830IDBVT - Texas Instruments

Description: Texas Instruments OPA830IDBVT Op Amp, 110MHz CMOS, 3 → 9 V, 5-Pin SOT-23

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PCB Footprints
OPA830IDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA830IDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA830IDBVT Details

  • Manufacturer Part Number:

    OPA830IDBVT

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    13 µA

  • Bias Current-Max (IIB) @25C:

    10 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    1 µA

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    260 V/us

  • Slew Rate-Nom:

    600 V/us

  • Supply Current-Max:

    4.7 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    110000

  • Voltage Gain-Min:

    1580

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA830IDBVT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA830IDBVT is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, use a low-ESR capacitor for decoupling, and consider adding a compensation capacitor (e.g., 10pF to 100pF) in parallel with the feedback resistor.
  • The recommended input common-mode voltage range for the OPA830IDBVT is between VCC- and VCC+, but not exceeding the power supply rails. Typically, it's recommended to keep the input common-mode voltage within 1V of the power supply rails.
  • While the OPA830IDBVT can be used as a comparator, it's not the most suitable choice due to its relatively slow slew rate (10V/μs) and limited output current (±20mA). A dedicated comparator IC would be a better option for most applications.
  • The OPA830IDBVT has internal ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent damage. Additionally, consider adding external ESD protection devices (e.g., TVS diodes) for enhanced protection.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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