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OPA835IDBVT - Texas Instruments

Description: Texas Instruments OPA835IDBVT Op Amp, 30MHz, 2.5 → 5.5 V Rail-Rail 130V/μs Low Power, 6-pin SOT-23

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PCB Footprints
OPA835IDBVT - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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3D Models
OPA835IDBVT - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV (R-PDSO-G6)
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OPA835IDBVT Details

  • Manufacturer Part Number:

    OPA835IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.53 µA

  • Bias Current-Max (IIB) @25C:

    0.4 µA

  • Common-mode Reject Ratio-Min:

    91 dB

  • Common-mode Reject Ratio-Nom:

    113 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.1 µA

  • Input Offset Voltage-Max:

    500 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    160 V/us

  • Supply Current-Max:

    0.35 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    30000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA835IDBVT Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA835IDBVT involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain and bandwidth. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes. Typically, a gain of 1-10 is recommended for most applications.
  • The maximum power dissipation of OPA835IDBVT is 1.4W. However, this can be limited by the thermal resistance of the package and the PCB. It's essential to ensure proper thermal management to prevent overheating.
  • Yes, OPA835IDBVT can be used in a single-supply configuration. However, the input common-mode voltage range is limited to VCC-1.5V to VCC+0.5V. A voltage divider or a reference voltage can be used to set the input common-mode voltage.
  • To filter out noise and oscillations, use a low-pass filter or a ferrite bead in series with the input signal. Additionally, ensure that the PCB layout is well-designed, and decoupling capacitors are placed close to the device. A 10nF-100nF capacitor in parallel with a 10Ω-100Ω resistor can be used to filter out high-frequency noise.

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OPA835IDBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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