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OPA838IDBVR - Texas Instruments

Description: 1-mA, 300-MHz Gain Bandwidth, Voltage-Feedback Op Amp

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PCB Footprints
OPA838IDBVR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-23 (6)
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3D Models
OPA838IDBVR - Texas Instruments  - 3D model - SOT23 (6-Pin) - SOT-23 (6)
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OPA838IDBVR Details

  • Manufacturer Part Number:

    OPA838IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-08-19

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    4.4 µA

  • Bias Current-Max (IIB) @25C:

    4.4 µA

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    105 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.07 µA

  • Input Offset Voltage-Max:

    125 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Min:

    250 V/us

  • Slew Rate-Nom:

    350 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.365 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    300000

  • Voltage Gain-Min:

    1000000

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA838IDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA838IDBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the gain resistors are properly matched, and the feedback capacitor is properly sized. A good rule of thumb is to keep the feedback capacitor value below 10pF. Additionally, ensure that the output is properly terminated and the input is properly biased.
  • The maximum power dissipation of OPA838IDBVR is 750mW. However, this can be limited by the thermal resistance of the package and the PCB. Ensure that the device is properly heat-sinked and the PCB is designed to dissipate heat efficiently.
  • Yes, OPA838IDBVR is rated for operation up to 125°C. However, the device's performance may degrade at high temperatures, and the maximum power dissipation may be limited. Ensure that the device is properly heat-sinked and the PCB is designed to dissipate heat efficiently.
  • To protect OPA838IDBVR from ESD damage, ensure that the device is handled and stored in an ESD-safe environment. Use ESD-safe materials and tools, and ensure that the device is properly grounded during handling and assembly.

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OPA838IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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