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OPA858IDSGR - Texas Instruments

Description: 5.5 GHz Gain Bandwidth Product, Decompensated Transimpedance Amplifier with FET Input

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PCB Footprints
OPA858IDSGR - Texas Instruments PCB footprint - Small Outline No-lead - Small Outline No-lead - WSON-8-3
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3D Models
OPA858IDSGR - Texas Instruments  - 3D model - Small Outline No-lead - WSON-8-3
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OPA858IDSGR Details

  • Manufacturer Part Number:

    OPA858IDSGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000005 µA

  • Bias Current-Max (IIB) @25C:

    0.000005 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    2000 V/us

  • Supply Current-Max:

    24 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5500000

  • Voltage Gain-Min:

    3981.072

  • Wideband:

    YES

  • Width:

    2 mm

OPA858IDSGR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA858IDSGR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network values and component placement guidelines in the datasheet. Additionally, use a low-ESR capacitor for decoupling and keep the feedback network impedance low.
  • The maximum power dissipation of OPA858IDSGR is dependent on the ambient temperature and the thermal resistance of the package. Use the formula Pd = (TJ - TA) / θJA to calculate the maximum power dissipation, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance.
  • Yes, OPA858IDSGR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Ensure proper thermal management and follow the recommended operating conditions to minimize thermal stress.
  • Use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Additionally, use a low-pass filter or a pi-filter to reduce EMI susceptibility.

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OPA858IDSGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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