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OPA875IDGKT - Texas Instruments

Description: Single 2:1 High-Speed Video Multiplexer

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PCB Footprints
OPA875IDGKT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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3D Models
OPA875IDGKT - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA875IDGKT Details

  • Manufacturer Part Number:

    OPA875IDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    VIDEO MULTIPLEXER

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage-Max (Vsup):

    -6 V

  • Neg Supply Voltage-Min (Vsup):

    -3 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    70 dB

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.1 A

  • Supply Current-Max (Isup):

    12 mA

  • Supply Voltage-Max (Vsup):

    10 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    60 ns

  • Switch-on Time-Max:

    9 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

OPA875IDGKT Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA875IDGKT involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain and bandwidth. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes. Typically, a ratio of 1:1 to 10:1 for Rf:Rg is recommended.
  • The maximum power dissipation of OPA875IDGKT is 1.4W. However, this can be limited by the thermal resistance of the package and the PCB. It's essential to ensure proper thermal management to prevent overheating.
  • Yes, OPA875IDGKT can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to prevent signal attenuation. A buffer configuration can also help to improve the output impedance and reduce distortion.
  • To filter out noise and interference, use a combination of passive and active filtering techniques. Add bypass capacitors to the power supply lines, use a ferrite bead or a common-mode choke to filter out high-frequency noise, and consider adding a low-pass filter at the output.

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OPA875IDGKT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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