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OR3T307S208-DB - Lattice Semiconductor

Description: FPGA - Field Programmable Gate Array 1568 LUT 221 I/O

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PCB Footprints
OR3T307S208-DB - Lattice Semiconductor PCB footprint - Quad Flat Packages - Quad Flat Packages - 208-Pin PQFP
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3D Models
OR3T307S208-DB - Lattice Semiconductor  - 3D model - Quad Flat Packages - 208-Pin PQFP
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OR3T307S208-DB Details

  • Manufacturer Part Number:

    OR3T307S208-DB

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Package Description:

    PLASTIC, SQFP-208

  • Pin Count:

    208

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Lattice Semiconductor Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    885 MHz

  • Combinatorial Delay of a CLB-Max:

    1.05 ns

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e0

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    196

  • Number of Equivalent Gates:

    48000

  • Number of Inputs:

    167

  • Number of Logic Cells:

    1568

  • Number of Outputs:

    167

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    70 °C

  • Organization:

    196 CLBS, 48000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    28 mm

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OR3T307S208-DB Overview

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