P1013NXE2LFB - NXP

P1013NXE2LFB Details

• Manufacturer Part Number:

  P1013NXE2LFB

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  TEBGAII-689

• ECCN Code:

  5A002.A.1

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  133 MHz

• Format:

  FLOATING POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B689

• JESD-609 Code:

  e2

• Length:

  31 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  8

• Number of Terminals:

  689

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA689,29X29,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  2.46 mm

• Speed:

  1067 MHz

• Supply Voltage-Max:

  1.05 V

• Supply Voltage-Min:

  0.95 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  31 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC