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P2020NXE2MHC - NXP

Description: QorIQ, 32-Bit Power Arch SoC, 2 X 1.2GHz, DDR2/3 w/ECC, GbE, PCIe, SRIO, USB, SEC, -40 to 125C, R2.1

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PCB Footprints
P2020NXE2MHC - NXP PCB footprint - BGA - BGA - SOT1745-1_2025
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3D Models
P2020NXE2MHC - NXP  - 3D model - BGA - SOT1745-1_2025
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P2020NXE2MHC Details

  • Manufacturer Part Number:

    P2020NXE2MHC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TEBGA-689

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    16

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    100 MHz

  • External Data Bus Width:

    64

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B689

  • JESD-609 Code:

    e2

  • Length:

    31 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    4

  • Number of External Interrupts:

    7

  • Number of Terminals:

    689

  • Operating Temperature-Max:

    125 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA689,29X29,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.46 mm

  • Speed:

    1200 MHz

  • Supply Voltage-Max:

    1.1 V

  • Supply Voltage-Min:

    1 V

  • Supply Voltage-Nom:

    1.05 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver (Sn/Ag)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    31 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

P2020NXE2MHC Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the P2020NXE2MHC is -40°C to 105°C.
  • The DDR3 memory interface on the P2020NXE2MHC can be configured using the Chip Configuration Registers (CCRs) and the DDR3 PHY registers. Refer to the P2020NXE2MHC Reference Manual for detailed information.
  • The maximum frequency of the e500mc core on the P2020NXE2MHC is 1.2 GHz.
  • Secure boot on the P2020NXE2MHC can be implemented using the Secure Boot mechanism, which involves generating a secure boot image using the CodeWarrior toolchain and programming it into the device's flash memory.
  • The power consumption of the P2020NXE2MHC varies depending on the operating frequency, voltage, and other factors. Refer to the P2020NXE2MHC datasheet for detailed power consumption information.

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P2020NXE2MHC Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image P2020NSE2MHC,557 NXP Semiconductors

RISC Microprocessor, 1200MHz, CMOS, PBGA689