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P21256-10 - Intel

Description: Dynamic RAM, Page Mode, 256K x 1, 16 Pin, Plastic, DIP

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PCB Footprints
P21256-10 - Intel PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - P21256-10
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3D Models
P21256-10 - Intel  - 3D model - Dual-In-Line Packages - P21256-10
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P21256-10 Details

  • Manufacturer Part Number:

    P21256-10

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    PLASTIC, DIP-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.02

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Access Mode:

    PAGE

  • Access Time-Max:

    100 ns

  • Additional Feature:

    RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH

  • I/O Type:

    SEPARATE

  • JESD-30 Code:

    R-PDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.43 mm

  • Memory Density:

    262144 bit

  • Memory IC Type:

    PAGE MODE DRAM

  • Memory Width:

    1

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    16

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX1

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Refresh Cycles:

    256

  • Seated Height-Max:

    3.61 mm

  • Supply Current-Max:

    0.055 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    MOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

P21256-10 Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the P21256-10, which includes recommendations for PCB layout, thermal design, and component placement. It's essential to follow these guidelines to ensure optimal performance, thermal management, and signal integrity.
  • Intel recommends using a power management IC (PMIC) specifically designed for the P21256-10. The PMIC should be able to provide the required voltage rails, power sequencing, and voltage regulation. Intel provides a list of recommended PMICs and design guidelines in their documentation.
  • The P21256-10 requires careful clock signal routing and termination to ensure signal integrity and minimize jitter. Intel recommends using a clock tree architecture, differential clock signals, and specific termination schemes. Refer to Intel's documentation for detailed guidelines and recommendations.
  • Intel provides a software development kit (SDK) and firmware development guidelines for the P21256-10. The SDK includes optimized firmware and software components, as well as tools and documentation to help developers optimize their code for the device.
  • The P21256-10 has specific thermal management and cooling requirements to ensure reliable operation. Intel recommends using a heat sink, thermal interface material, and a cooling system that can maintain a junction temperature below the specified maximum. Refer to Intel's documentation for detailed thermal design guidelines.

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P21256-10 Overview

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