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P3A9606JKZ - NXP

Description: Translation - Voltage Levels Dual bidirectional I3C/I2C-bus and SPI voltage-level translator

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P3A9606JKZ - NXP PCB footprint - Other - Other - P3A9606JKZ-3
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P3A9606JKZ - NXP  - 3D model - Other - P3A9606JKZ-3
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P3A9606JKZ Details

  • Manufacturer Part Number:

    P3A9606JKZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    X2SON-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Delay-Max:

    19.9 ns

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    1.35 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.04,14

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.33 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    1.98 V

  • Supply Voltage-Min:

    0.72 V

  • Supply Voltage-Nom:

    1.2 V

  • Supply Voltage1-Max:

    1.98 V

  • Supply Voltage1-Min:

    0.72 V

  • Supply Voltage1-Nom:

    1 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.35 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1 mm

P3A9606JKZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Monitor input voltage, output voltage, current, and temperature. Implement over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP).
  • Use a shielded enclosure, keep sensitive components away from the P3A9606JKZ, and use a common-mode choke or ferrite bead to filter noise.
  • Use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF and 10 μF, depending on the input voltage and output current requirements.

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P3A9606JKZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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