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P6KE7.5CA-TP - MCC

Description: TVS

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P6KE7.5CA-TP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-15
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P6KE7.5CA-TP - MCC  - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-15
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P6KE7.5CA-TP Details

  • Manufacturer Part Number:

    P6KE7.5CA-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-15

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-2

  • Pin Count:

    2

  • Reach Compliance Code:

    Not Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.26

  • Breakdown Voltage-Max:

    7.88 V

  • Breakdown Voltage-Min:

    7.13 V

  • Breakdown Voltage-Nom:

    7.5 V

  • Case Connection:

    ISOLATED

  • Clamping Voltage-Max:

    11.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-15

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    6.4 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

P6KE7.5CA-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for P6KE7.5CA-TP can be found in the manufacturer's application note or packaging specification document. Typically, a standard SOD123 footprint with a 1.5mm x 0.8mm pad size is recommended.
  • To ensure reliability in high-temperature applications, ensure that the device is operated within its specified temperature range (-65°C to 150°C). Also, consider using a heat sink or thermal pad to dissipate heat, and follow proper PCB design and layout guidelines to minimize thermal resistance.
  • No, it's not recommended to use P6KE7.5CA-TP in a circuit with a voltage higher than 7.5V, as it may exceed the device's maximum clamping voltage and lead to premature failure or damage.
  • Select the correct P6KE7.5CA-TP variant by considering factors such as the required breakdown voltage, peak pulse current, and package type. Consult the datasheet and application notes to ensure the selected device meets your application's requirements.
  • P6KE7.5CA-TP has built-in ESD protection, but additional measures such as using ESD-sensitive device handling procedures, using anti-static packaging, and implementing latch-up prevention techniques (e.g., using a series resistor) are still recommended to prevent damage during handling and operation.

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P6KE7.5CA-TP Overview

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Part Image P6KE7.5CA Microsemi Corporation (now Microchip)

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Part Image SA6.5C Semtech Corporation

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For a full list of alternate parts for P6KE7.5CA-TP, check out Findchips.com