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P78E05-1000 - CUI Inc.

Description: Non-Isolated DC/DC Converters 8-36Vin +/-5V 1A SIP Non-Iso

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PCB Footprints
P78E05-1000 - CUI Inc. PCB footprint - Other - Other - P78E12-1000
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3D Models
P78E05-1000 - CUI Inc.  - 3D model - Other - P78E12-1000
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P78E05-1000 Details

  • Manufacturer Part Number:

    P78E05-1000

  • Brand Name:

    CUI Inc

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SIP-3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-09-14

  • Manufacturer:

    CUI Inc

  • YTEOL:

    3

  • Additional Feature:

    IT ALSO HAS -5V OUTPUT VOLTAGE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    8 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PSIP-T3

  • Length:

    11.6 mm

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    5.15 V

  • Output Voltage-Min:

    4.85 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SIP

  • Package Equivalence Code:

    SIP3,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    10.9 mm

  • Surface Mount:

    NO

  • Switching Frequency-Max:

    520 kHz

  • Temperature Grade:

    OTHER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    8 mm

P78E05-1000 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the device, and to use thermal vias to dissipate heat to the other side of the board. Additionally, keeping the component side of the board clear of other components and using a thermal interface material can help improve heat dissipation.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250-270°C. Apply a small amount of solder paste to the PCB pads, and place the device on the PCB. Use a reflow oven or a hot air gun to melt the solder paste. Ensure the device is properly aligned and the solder joints are smooth and shiny.
  • To prevent ESD damage, handle the device in an ESD-controlled environment, wear an ESD strap or wrist strap, and use ESD-safe packaging materials. Avoid touching the device's pins or components, and use an ESD-safe workstation or mat.
  • The P78E05-1000 is rated for industrial temperature range (-40°C to 100°C). For high-reliability or high-temperature applications, consider using a device with a higher temperature rating or a more robust package. Consult with the manufacturer or a qualified engineer to determine the suitability of the device for your specific application.
  • To troubleshoot issues with the device, start by verifying the input voltage, output voltage, and current. Check the PCB layout and component placement for any thermal or electrical issues. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for troubleshooting guidelines, and contact the manufacturer's technical support if necessary.

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P78E05-1000 Overview

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