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P82B96DP,118 - NXP

Description: NXP P82B96DP,118, Dual, Bus Buffer, 8-Pin TSSOP

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Symbol
P82B96DP,118 - NXP - PCB symbol
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PCB Footprints
P82B96DP,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP8
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3D Models
P82B96DP,118 - NXP - 3D model - Small Outline Packages - TSSOP8
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P82B96DP,118 Details

  • Manufacturer Part Number:

    P82B96DP,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT505-1

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

P82B96DP,118 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible, and use a common mode choke to reduce EMI.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF X7R) as close as possible to the device's power pins. Add a 1uF capacitor in parallel to filter high-frequency noise.
  • The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device. Ensure proper voltage clamping or limiting circuits are used to prevent overvoltage.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check for proper power supply, decoupling, and signal integrity. Consult the datasheet and application notes for guidance on troubleshooting common issues.
  • The P82B96DP,118 is rated for operation up to 125°C. However, ensure proper thermal management, such as heat sinks or thermal pads, to prevent overheating and reduce the risk of device failure.

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P82B96DP,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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