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P82B96DPZ - NXP

Description: Interface - Signal Buffers, Repeaters I2C-bus buffer

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P82B96DPZ - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT505-1
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P82B96DPZ - NXP  - 3D model - Small Outline Packages - SOT505-1
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P82B96DPZ Details

  • Manufacturer Part Number:

    P82B96DPZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-8

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    S-PDSO-G8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

P82B96DPZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
  • Use a thermal pad or a heat sink to dissipate heat, and ensure good airflow around the device. Also, consider using a thermistor to monitor the temperature and adjust the operating conditions accordingly.
  • Use a common mode choke, a differential mode inductor, and a capacitor to filter out EMI. The choke should be placed close to the device, and the capacitor should be placed between the input and output tracks.
  • Use a low-dropout linear regulator or a switching regulator with a high efficiency to minimize power loss. Also, consider using a power gating technique to turn off unused circuits.
  • Consider the thermal resistance of the device, the PCB, and the surrounding environment. Use thermal simulation tools to optimize the design and ensure that the device operates within the recommended temperature range.

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P82B96DPZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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