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P82B96DR - Texas Instruments

Description: DUAL BIDIRECTIONAL BUS BUFFER

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P82B96DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - +soic d
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P82B96DR Details

  • Manufacturer Part Number:

    P82B96DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Interface IC Type:

    BUS BUFFERS

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    15 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

P82B96DR Frequently Asked Questions (FAQs)

  • A good PCB layout for the P82B96DR involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure proper powering and decoupling of the P82B96DR, use a high-quality power source, add decoupling capacitors (e.g., 10uF and 100nF) close to the device, and use a low-ESR capacitor (e.g., 10uF) for the output. Also, ensure the input voltage is within the recommended range (2.7V to 5.5V).
  • The maximum output current of the P82B96DR is 1A. However, it's recommended to limit the output current to 500mA for optimal performance and to prevent overheating.
  • To protect the P82B96DR from overvoltage and undervoltage conditions, use a voltage supervisor or a reset IC to monitor the input voltage and reset the device if it falls outside the recommended range. Additionally, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits.
  • To manage thermal issues with the P82B96DR, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad on the bottom of the package. Also, consider using a thermal interface material (TIM) to improve heat transfer.

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P82B96DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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