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P87C52UBPN,112 - NXP

Description: 8051 series Microcontroller IC 8-Bit 33MHz 8KB (8K x 8) OTP 40-DIP

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P87C52UBPN,112 - NXP PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
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P87C52UBPN,112 - NXP  - 3D model - Dual-In-Line Packages - DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for P87C52UBPN,112
  • Part Number P87C52UBPN,112
  • Manufacturer NXP
  • Pin Count 40
  • Part Category Integrated Circuit
  • Package Category Dual-In-Line Packages
  • Footprint Name Dual-In-Line Packages - DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1
  • Released Date Aug 17, 2022
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

P87C52UBPN,112 Details

  • Manufacturer Part Number:

    P87C52UBPN,112

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    0.600 INCH, PLASTIC, MO-015, SOT129-1, DIP-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    SOT129-1

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    NO

  • Address Bus Width:

    16

  • Bit Size:

    8

  • Boundary Scan:

    YES

  • CPU Family:

    8051

  • Clock Frequency-Max:

    33 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PDIP-T40

  • JESD-609 Code:

    e3

  • Length:

    52 mm

  • Number of I/O Lines:

    32

  • Number of Terminals:

    40

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    70 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP40,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    256

  • ROM (words):

    8192

  • ROM Programmability:

    OTPROM

  • Seated Height-Max:

    4.7 mm

  • Speed:

    33 MHz

  • Supply Current-Max:

    30.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

P87C52UBPN,112 Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the P87C52UBPN,112 is 40 MHz.
  • The oscillator can be configured using the XTAL1 and XTAL2 pins. A crystal oscillator or a ceramic resonator can be used. The datasheet provides guidelines for selecting the correct values for the oscillator components.
  • The power consumption of the P87C52UBPN,112 depends on the operating frequency and voltage. At 5V and 40 MHz, the typical power consumption is around 35 mA. However, this value can vary depending on the specific application and usage.
  • Yes, the P87C52UBPN,112 can operate with a 3.3V power supply. However, the maximum operating frequency will be limited to 24 MHz. Consult the datasheet for more information on voltage and frequency scaling.
  • The P87C52UBPN,112 can be programmed using a variety of tools and programming languages, including Keil µVision, IAR Embedded Workbench, and NXP's own programming tools. The device can be programmed using the serial programming interface (SPI) or the parallel programming interface.

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P87C52UBPN,112 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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