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PA02M - Apex Microtechnology

Description: 350kHz, 5A, 20V/µs Power Amplifier with Fast Settling Time

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PA02M - Apex Microtechnology PCB footprint - Other - Other - CE
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PA02M - Apex Microtechnology  - 3D model - Other - CE
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PA02M Details

  • Manufacturer Part Number:

    PA02M

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-204AA

  • Package Description:

    HERMETIC SEALED, TO-3, 8 PIN

  • Pin Count:

    2

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Apex Microtechnology Inc

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    O-MBFM-P8

  • JESD-609 Code:

    e0

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Neg Supply Voltage Limit-Max:

    -19 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    METAL

  • Package Equivalence Code:

    CAN8/9,.5FL

  • Package Shape:

    ROUND

  • Package Style:

    FLANGE MOUNT

  • Power:

    YES

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883 Class B (Modified)

  • Slew Rate-Min:

    8.5 V/us

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    60 mA

  • Supply Voltage Limit-Max:

    19 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    BOTTOM

  • Unity Gain BW-Nom:

    4500

  • Voltage Gain-Min:

    20000

PA02M Frequently Asked Questions (FAQs)

  • Apex Microtechnology recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A heat sink or thermal pad can also be used to improve thermal management.
  • To ensure reliable operation at high temperatures, Apex recommends derating the output current and voltage, and using a heat sink or thermal pad to keep the junction temperature below 150°C. Additionally, using a thermistor or thermal sensor can help monitor the temperature and prevent overheating.
  • Apex recommends using input capacitance of 10-100nF and output capacitance of 100-1000nF to ensure stable operation and minimize ringing. The exact values may vary depending on the specific application and layout.
  • Apex recommends using overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the device. Additionally, using a fuse or current-limiting resistor can help protect the device from excessive current.
  • Apex recommends a slow startup sequence (typically 10-100ms) to prevent inrush currents and ensure stable operation. The shutdown sequence should also be slow to prevent voltage spikes and ensure the device is fully discharged.

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PA02M Overview

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