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PA1206FRE470R003Z - Yageo Group

Description: Current Sense Resistors - SMD 3 mOhms 1W 50PPM / C 1 % 1206 AEC-Q200

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Symbol
PA1206FRE470R003Z - Yageo Group - PCB symbol
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PCB Footprints
PA1206FRE470R003Z - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - 1206 (Rsense)
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3D Models
PA1206FRE470R003Z - Yageo Group - 3D model - Resistor Chip - 1206 (Rsense)
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PA1206FRE470R003Z Details

  • Manufacturer Part Number:

    PA1206FRE470R003Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.4 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.003 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.05 V

PA1206FRE470R003Z Frequently Asked Questions (FAQs)

  • The recommended land pattern for PA1206FRE470R003Z is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
  • PA1206FRE470R003Z is rated for operation up to 150°C, but it's recommended to derate the component's power rating and consider the application's thermal management to ensure reliable operation. Consult YAGEO's application notes for high-temperature usage guidelines.
  • PA1206FRE470R003Z is a moisture-sensitive device (MSD) with a moisture sensitivity level (MSL) of 3. Handle the component according to IPC/JEDEC J-STD-033C guidelines to prevent moisture-related defects during assembly and storage.
  • The recommended soldering profile for PA1206FRE470R003Z is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Consult YAGEO's application notes for specific soldering profile guidelines.
  • PA1206FRE470R003Z is a rigid component, and its use in a flex circuit or flexible PCB is not recommended. The component's termination style and material may not be suitable for flexible PCB applications. Consult YAGEO's application notes for guidance on using similar components in flexible PCBs.

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PA1206FRE470R003Z Overview

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