PA1206FRF470R006L footprint, schematic symbol and 3D model by Yageo Group

Symbol

PCB Footprints

3D Models

PA1206FRF470R006L Details

The recommended land pattern for PA1206FRF470R006L is a rectangular pad with a size of 1.7mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
Yes, PA1206FRF470R006L is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
Yes, PA1206FRF470R006L is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's crucial to follow the recommended soldering profile to prevent damage to the component.
PA1206FRF470R006L has a moisture sensitivity level (MSL) of 2, which means it can be exposed to a maximum of 30°C/60% RH for 168 hours before soldering. Proper storage and handling procedures should be followed to prevent moisture absorption.
Yes, PA1206FRF470R006L is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency (SRF). However, it's essential to consider the component's parasitic effects and layout considerations to ensure optimal performance.

Community Provided

System Verified

Community Approved

Use the download button to access the PA1206FRF470R006L schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like PA120, or try a keyword search, such as Fixed Resistors

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →