PA2010FKE470R001Z footprint, schematic symbol and 3D model by Yageo Group

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PA2010FKE470R001Z Details

The recommended land pattern for PA2010FKE470R001Z is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm. The land pattern should be designed to accommodate the component's termination style and ensure good solderability.
PA2010FKE470R001Z is rated for operation up to 150°C, but it's recommended to derate the component's power rating and consider the application's thermal management to ensure reliable operation. Consult YAGEO's application notes for more information on high-temperature usage.
PA2010FKE470R001Z is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. Follow YAGEO's recommended storage and handling procedures, and ensure that the component is baked according to the datasheet's instructions before reflow soldering.
The recommended soldering profile for PA2010FKE470R001Z is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the component's specified temperature range to prevent damage.
PA2010FKE470R001Z is designed to withstand moderate vibration levels, but it's recommended to consult YAGEO's application notes and perform additional testing to ensure the component's reliability in high-vibration environments.

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