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PA2512FKF7W0U75E - Yageo Group

Description: Current Sense Resistors - SMD 750uOhms 2W 100PPM/C 2512 AEC-Q200

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PA2512FKF7W0U75E - Yageo Group - PCB symbol
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PCB Footprints
PA2512FKF7W0U75E - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - PA2512_2024
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3D Models
PA2512FKF7W0U75E - Yageo Group - 3D model - Resistor Chip - PA2512_2024
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PA2512FKF7W0U75E Details

  • Manufacturer Part Number:

    PA2512FKF7W0U75E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    7.25

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.63 mm

  • Package Length:

    6.35 mm

  • Package Style:

    SMT

  • Package Width:

    3.18 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Power Dissipation (P):

    2 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.00075 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.0387 V

PA2512FKF7W0U75E Frequently Asked Questions (FAQs)

  • The recommended land pattern for PA2512FKF7W0U75E is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • PA2512FKF7W0U75E has a maximum operating temperature of 150°C, making it suitable for high-temperature applications. However, it's essential to consider the derating of the component's characteristics at elevated temperatures.
  • Yes, PA2512FKF7W0U75E is compatible with lead-free soldering processes, such as SAC305 (Sn-Ag-Cu) or other lead-free solder alloys. However, it's crucial to follow the recommended soldering profile to ensure reliable assembly.
  • PA2512FKF7W0U75E has a moisture sensitivity level (MSL) of 3, which means it can withstand a maximum of 168 hours of exposure to 30°C/60% RH before soldering. Proper storage and handling are essential to prevent moisture absorption.
  • While PA2512FKF7W0U75E is designed to operate in a wide range of environmental conditions, it's not recommended for applications with extremely high humidity or moisture. The component may be susceptible to moisture-related failures or degradation in such environments.

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PA2512FKF7W0U75E Overview

Use the download button to access the PA2512FKF7W0U75E schematic symbol, PCB footprint, and 3D model.
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