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PA50A - Apex Microtechnology

Description: The PA50 is a 40A, 100V power operational amplifier featuring 200kHz of power bandwidth and a 50V/µs slew rate. With this combination of high current output, bandwidth, slew rate, and 400 watts of internal power dissipation, the PA50 is targeted for applications in the semi-cap equipment market. Another exceptional feature of the PA50 is its boost voltage inputs that allow the small signal portion of the amplifier to operate at a higher voltage than the high current output stage. The amplifier is then bias

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PA50A - Apex Microtechnology PCB footprint - Other - Other - CR
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PA50A - Apex Microtechnology  - 3D model - Other - CR
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PA50A Details

  • Manufacturer Part Number:

    PA50A

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFM

  • Package Description:

    ROHS COMPLIANT, POWER, HERMETIC SEALED, MO-127, DIP-12

  • Pin Count:

    12

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Apex Microtechnology Inc

  • YTEOL:

    4.15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-MDFM-P12

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -50 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    METAL

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP12,1.2,200TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power:

    YES

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Slew Rate-Min:

    50 V/us

  • Supply Current-Max:

    36 mA

  • Supply Voltage Limit-Max:

    50 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    NICKEL

  • Terminal Form:

    PIN/PEG

  • Terminal Pitch:

    5.08 mm

  • Terminal Position:

    DUAL

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    50100

  • Wideband:

    NO

PA50A Frequently Asked Questions (FAQs)

  • Apex Microtechnology recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A minimum of 2 oz copper thickness is recommended for the top and bottom layers. Additionally, a heat sink or thermal interface material can be used to further improve thermal performance.
  • The PA50A has internal overcurrent protection, but it's still recommended to add external protection circuitry, such as a voltage regulator and current limiter, to prevent damage from overvoltage and overcurrent conditions. Additionally, a fuse or circuit breaker can be used to disconnect power in case of a fault.
  • Apex Microtechnology recommends using a pi-filter or LC-filter at the input and output of the PA50A to reduce electromagnetic interference (EMI) and ensure stable operation. The filter components should be chosen based on the specific application and frequency range.
  • The PA50A requires a specific bias voltage and current to operate correctly. Apex Microtechnology provides a recommended bias circuit in the datasheet, but the specific values may need to be adjusted based on the application. It's recommended to consult with an applications engineer or use simulation tools to determine the optimal bias configuration.
  • Apex Microtechnology provides reliability data for the PA50A, including MTBF (Mean Time Between Failures) and FIT (Failures in Time) rates, which can be found in the datasheet or by contacting their technical support. The actual reliability of the device will depend on the specific application, operating conditions, and quality of the PCB assembly.

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PA50A Overview

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