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PAC25140NSR - Qorvo

Description: Intelligent Battery Management SOC with integrated Arm Cortex M4F MCU & Cell Balancing

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PCB Footprints
PAC25140NSR - Qorvo PCB footprint - Other - Other - QFN68_Offset_Pad
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3D Models
PAC25140NSR - Qorvo  - 3D model - Other - QFN68_Offset_Pad
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PAC25140NSR Details

  • Manufacturer Part Number:

    PAC25140NSR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Qorvo

  • YTEOL:

    6

  • Analog IC - Other Type:

    POWER SUPPLY MANAGEMENT CIRCUIT

  • Moisture Sensitivity Level:

    3

  • Peak Reflow Temperature (Cel):

    260

  • Time@Peak Reflow Temperature-Max (s):

    30

PAC25140NSR Frequently Asked Questions (FAQs)

  • Qorvo recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • To ensure accurate current sensing, use a Kelvin connection to the sense pins, keep the sense traces short and symmetrical, and avoid running high-frequency signals near the sense traces.
  • Although the datasheet specifies a maximum VCC of 5.5V, Qorvo recommends limiting the voltage to 5V to ensure reliable operation and minimize the risk of damage.
  • While the PAC25140NSR is rated for operation up to 125°C, Qorvo recommends derating the current sense accuracy and power dissipation at high temperatures to ensure reliable operation.
  • Qorvo recommends using a logic analyzer or oscilloscope to monitor the device's output signals, checking for proper power supply and decoupling, and verifying the PCB layout and assembly.

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PAC25140NSR Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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