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PAM3101DAB280 - Diodes Incorporated

Description: IC REG LINEAR 2.8V 300MA SOT23-5

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PCB Footprints
PAM3101DAB280 - Diodes Incorporated PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT-23-5_2021
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3D Models
PAM3101DAB280 - Diodes Incorporated  - 3D model - SOT23 (5-Pin) - SOT-23-5_2021
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PAM3101DAB280 Details

  • Manufacturer Part Number:

    PAM3101DAB280

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.45 V

  • Dropout Voltage1-Nom:

    0.37 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.3 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.0014%

  • Load Regulation-Max:

    0.056%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    2.856 V

  • Output Voltage1-Min:

    2.744 V

  • Output Voltage1-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.6 mm

PAM3101DAB280 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Monitor the input voltage, output current, and junction temperature to ensure they are within the recommended operating conditions specified in the datasheet. Use proper thermal management and PCB design to prevent overheating.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed close to the device's input pins to minimize noise and ripple.
  • Use a shielded enclosure, keep the device and PCB traces away from sensitive circuits, and use a common-mode choke or ferrite bead to filter the output. Follow good PCB design practices, such as using a solid ground plane and minimizing loop areas.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for output filtering. The capacitor should be placed close to the device's output pins to minimize noise and ripple.

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PAM3101DAB280 Overview

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