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PAMC3301DWER - Texas Instruments

Description: Texas Instruments ±250-mV input, precision reinforced isolated amplifier with integrated DC/DC converter 16-SOIC -40 to 125

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PAMC3301DWER - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DWE0016A
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PAMC3301DWER - Texas Instruments  - 3D model - Small Outline Packages - DWE0016A
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PAMC3301DWER Details

  • Manufacturer Part Number:

    PAMC3301DWER

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2019-08-29

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Analog Input Voltage-Max:

    0.25 V

  • Analog Input Voltage-Min:

    -0.25 V

  • Bandwidth (3dB)-Nom:

    0.334 MHz

  • Common Mode Voltage-Max:

    1.49 V

  • Isolation Voltage-Min:

    5000 V

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    31 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    7.5 mm

PAMC3301DWER Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good layout practices, such as keeping the input and output traces separate, using a solid ground plane, and minimizing parasitic inductance. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • The PAMC3301DWER is rated for operation from -40°C to 125°C. To ensure operation within this range, it's essential to provide adequate heat sinking, especially in high-power applications. A thermal pad on the bottom of the package can be connected to a heat sink or a thermal via to dissipate heat. Additionally, ensure that the device is not exposed to extreme temperatures during storage or handling.
  • The recommended input capacitor value is 10uF to 22uF, with a voltage rating of at least 25V. A low-ESR ceramic capacitor, such as an X5R or X7R type, is recommended. The capacitor should be placed as close as possible to the VIN pin to minimize inductance and ensure stable operation.
  • To troubleshoot issues with the PAMC3301DWER, start by verifying the input voltage, output voltage, and current. Check for proper PCB layout, component selection, and soldering. Ensure that the device is not overheating by checking the temperature of the package. Use an oscilloscope to monitor the output voltage and current waveforms. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the PAMC3301DWER is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard for automotive applications and is manufactured using a high-reliability process. However, it's essential to follow proper design and manufacturing practices to ensure the device operates reliably in these applications.

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PAMC3301DWER Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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