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PATT0805L2R80FGT1 - Vishay

Description: Thin Film Resistors - SMD .20watt 2.8ohm 1% 200ppm

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PATT0805L2R80FGT1 - Vishay - PCB symbol
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PCB Footprints
PATT0805L2R80FGT1 - Vishay PCB footprint - Resistor Chip - Resistor Chip - 0805_2022-28
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3D Models
PATT0805L2R80FGT1 - Vishay - 3D model - Resistor Chip - 0805_2022-28
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PATT0805L2R80FGT1 Details

  • Manufacturer Part Number:

    PATT0805L2R80FGT1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    10

  • Additional Feature:

    ANTI-SULFUR, LASER TRIMMABLE, PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    250 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.381 mm

  • Package Length:

    2.032 mm

  • Package Style:

    SMT

  • Package Width:

    1.27 mm

  • Packing Method:

    TR

  • Rated Power Dissipation (P):

    0.2 W

  • Rated Temperature:

    155 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    2.8 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    100 V

PATT0805L2R80FGT1 Frequently Asked Questions (FAQs)

  • The recommended land pattern for PATT0805L2R80FGT1 is a rectangular pad with a size of 1.2 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • While PATT0805L2R80FGT1 is rated for operation up to 150°C, it's not recommended for high-temperature applications above 125°C. The component's performance and reliability may degrade at higher temperatures. If high-temperature operation is required, consider using a different component or consulting with Vishay's application engineers.
  • PATT0805L2R80FGT1 is a moisture-sensitive device (MSD) with a moisture sensitivity level (MSL) of 3. To prevent damage, store the components in a dry environment (less than 30% relative humidity) and follow the recommended baking and handling procedures before soldering.
  • The recommended soldering profile for PATT0805L2R80FGT1 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • While PATT0805L2R80FGT1 is designed to be robust, it's not specifically designed for high-vibration environments. If your application involves high vibration, consider using a different component or consulting with Vishay's application engineers to determine the component's suitability.

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PATT0805L2R80FGT1 Overview

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PATT0805L2R80FGT1 Alternates

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Part Image PATT0805L2R80FGT5 Vishay Intertechnologies

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Part Image PATT0805L2R80FGTP Vishay Intertechnologies

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Part Image PATT0805L2R80FGT0 Vishay Intertechnologies

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Part Image PATT0805L2R80FGWI Vishay Intertechnologies

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For a full list of alternate parts for PATT0805L2R80FGT1, check out Findchips.com