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PBSS8110Z,135 - Nexperia

Description: NXP PBSS8110Z,135 NPN Transistor, 1 A, 100 V, 4-Pin SC-73

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Symbol
PBSS8110Z,135 - Nexperia - PCB symbol
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PCB Footprints
PBSS8110Z,135 - Nexperia PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223_2023
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3D Models
PBSS8110Z,135 - Nexperia - 3D model - SOT223 (3-Pin) - SOT-223_2023
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PBSS8110Z,135 Details

  • Manufacturer Part Number:

    PBSS8110Z,135

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-73

  • Package Description:

    SC-73, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT223

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    1 A

  • Collector-Emitter Voltage-Max:

    100 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    150

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

PBSS8110Z,135 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation in high-temperature environments, ensure the device is operated within the recommended temperature range, use a heat sink or thermal pad, and consider using a thermal interface material to improve heat transfer.
  • Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It's essential to ensure the device operates within the recommended temperature range.
  • To protect the device from ESD, handle the device by the body or use an anti-static wrist strap, store the device in an anti-static bag or container, and use an ESD-protected workstation.
  • The recommended soldering conditions for the PBSS8110Z,135 involve using a soldering iron with a temperature of 260°C (500°F) for 10 seconds or less, and ensuring the device is not exposed to temperatures above 260°C (500°F) for more than 10 seconds.

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PBSS8110Z,135 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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