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PCA9450BHNY - NXP

Description: Power Management Specialized - PMIC Power Manage IC (PMIC) for i.MX 8M Nano

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Symbol
PCA9450BHNY - NXP - PCB symbol
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PCB Footprints
PCA9450BHNY - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN56 (SOT949-6)_1
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3D Models
PCA9450BHNY - NXP - 3D model - Quad Flat No-Lead - HVQFN56 (SOT949-6)_1
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PCA9450BHNY Details

  • Manufacturer Part Number:

    PCA9450BHNY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    INTEGRATED POWER MANAGEMENT UNIT

  • JESD-30 Code:

    S-XQCC-N56

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    11

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC56,.27SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

PCA9450BHNY Frequently Asked Questions (FAQs)

  • A good PCB layout for the PCA9450BHNY involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The PCA9450BHNY requires a single 1.8V power supply. Ensure that the power supply is stable and clean, and that the device is powered up in the correct sequence. Power up the device in the following order: VDD, then VDDIO, and finally the input signals.
  • The PCA9450BHNY has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow.
  • The PCA9450BHNY has a relatively high output impedance. To maintain signal integrity, use a termination resistor close to the device, and consider using a series resistor to match the impedance of the transmission line. Ensure that the PCB trace impedance is matched to the output impedance of the device.
  • The PCA9450BHNY has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.

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PCA9450BHNY Overview

Use the download button to access the PCA9450BHNY schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PCA94, or try a keyword search, such as Power Management Circuits

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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