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PCA9561D,118 - NXP

Description: IC INTERFACE SPECIALIZED 20SO

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PCA9561D,118 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
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3D Models
PCA9561D,118 - NXP  - 3D model - Small Outline Packages - TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for PCA9561D,118
  • Part Number PCA9561D,118
  • Manufacturer NXP
  • Pin Count 20
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
  • Released Date Oct 15, 2020
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

PCA9561D,118 Details

  • Manufacturer Part Number:

    PCA9561D,118

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOP

  • Package Description:

    7.50 MM, PLASTIC, MS-013, SOT-163-1, SO-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    SOT163-1

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    6-BIT 5-TO-1 MULTIPLEXER

  • Family:

    PCA9

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    12.8 mm

  • Load Capacitance (CL):

    10 pF

  • Logic IC Type:

    MULTIPLEXER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Inputs:

    6

  • Number of Outputs:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Supply Current-Max (ICC):

    1 mA

  • Prop. Delay@Nom-Sup:

    40 ns

  • Propagation Delay (tpd):

    40 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    7.5 mm

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PCA9561D,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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