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PCI2060IGHK - Texas Instruments

Description: Asynchronous, 32-Bit, 66 MHz PCI-to-PCI Bridge, Compact PCI Hot-Swap Friendly, 9-Master

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PCI2060IGHK - Texas Instruments - PCB symbol
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PCB Footprints
PCI2060IGHK - Texas Instruments PCB footprint - BGA - BGA - GHK (S-PBGA-N257)
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3D Models
PCI2060IGHK - Texas Instruments - 3D model - BGA - GHK (S-PBGA-N257)
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PCI2060IGHK Details

  • Manufacturer Part Number:

    PCI2060IGHK

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    PLASTIC, BGA-257

  • Pin Count:

    257

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Address Bus Width:

    32

  • Bus Compatibility:

    PCI

  • Clock Frequency-Max:

    66 MHz

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PBGA-B257

  • JESD-609 Code:

    e0

  • Length:

    16 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    257

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA257,19X19,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    16 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, PCI

PCI2060IGHK Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 10uF) close to the device.
  • Use a reliable clock source, ensure proper termination of the PCI bus, and implement a robust reset circuit. Also, ensure that the device is properly configured and initialized before attempting communication.
  • The core voltage (VCC) should be powered up before the I/O voltage (VCCIO). The recommended power-up sequence is: VCCIO, then VCC. Ensure that the power supplies are stable and within the recommended voltage ranges.
  • The PCI2060IGHK has a built-in JTAG interface for boundary scan and debugging. Ensure that the JTAG pins are properly connected and configured. Use a JTAG adapter or a compatible debugger to access the device.
  • The device has a maximum junction temperature of 150°C. Ensure good airflow, use a heat sink if necessary, and avoid blocking the airflow around the device. Monitor the device temperature and adjust the thermal design accordingly.

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PCI2060IGHK Overview

Use the download button to access the PCI2060IGHK schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PCI20, or try a keyword search, such as Bus Controllers

About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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