PCN2-S24-S5-S - CUI Inc.

PCN2-S24-S5-S Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1 W/m-K or higher is suggested to improve heat transfer between the device and the heat sink.
• How do I ensure reliable operation in high-vibration environments?
  To ensure reliable operation in high-vibration environments, CUI recommends securing the device using a screw or adhesive that can withstand the expected vibration levels. Additionally, the PCB should be designed to minimize flexure and ensure that the device is properly supported.
• What is the maximum allowable voltage derating for this device?
  CUI recommends derating the input voltage by 10% to ensure reliable operation and to account for any voltage tolerances. For example, if the rated input voltage is 24V, the maximum allowable voltage derating would be 21.6V.
• Can I use this device in a redundant or parallel configuration?
  Yes, the PCN2-S24-S5-S can be used in a redundant or parallel configuration to improve system reliability and availability. However, it is essential to ensure that the devices are properly synchronized and that the system is designed to handle the increased power output.
• What is the typical MTBF (Mean Time Between Failures) for this device?
  CUI estimates the MTBF for the PCN2-S24-S5-S to be around 1.5 million hours at 25°C, based on MIL-HDBK-217F calculations. However, this value may vary depending on the specific application and operating conditions.