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PDM1-S24-D12-S - CUI Inc.

Description: Isolated DC/DC Converters dc-dc isolated, 1 W, 21.6~26.4 Vdc input, + / -12 Vdc, 42 mA, dual unregulated output, SIP

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PCB Footprints
PDM1-S24-D12-S - CUI Inc. PCB footprint - Other - Other - PDM1-S24-D12-S-2
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3D Models
PDM1-S24-D12-S - CUI Inc.  - 3D model - Other - PDM1-S24-D12-S-2
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PDM1-S24-D12-S Details

  • Manufacturer Part Number:

    PDM1-S24-D12-S

  • Brand Name:

    CUI Inc

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    CUI Inc

  • YTEOL:

    0

  • Additional Feature:

    ADDITIONAL -12V OUTPUT AVAILABLE

  • Analog IC - Other Type:

    DC-DC UNREGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    26.4 V

  • Input Voltage-Min:

    21.6 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PSMA-T5

  • Length:

    19.6 mm

  • Load Regulation-Max:

    15%

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.042 A

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SIP5/6,.05

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    10.25 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    2 W

  • Trim/Adjustable Output:

    NO

  • Width:

    7 mm

PDM1-S24-D12-S Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the device to improve heat dissipation. A minimum of 2 oz copper thickness and a thermal relief pattern are recommended for optimal thermal performance.
  • Secure the device to the PCB using a suitable adhesive or mechanical fastening method. Ensure the PCB is properly secured to the system to minimize vibration transfer.
  • A 10-22 μF, X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible.
  • Yes, but ensure proper synchronization and current sharing mechanisms are implemented to prevent uneven current distribution and potential damage.
  • The maximum allowed case temperature is 125°C. Operating above this temperature may reduce the device's reliability and lifespan.

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PDM1-S24-D12-S Overview

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