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PDS360Q-13 - Diodes Incorporated

Description: Schottky Diodes & Rectifiers 3A Schottky Rec 60Vrrm 42Vr 100 Ifsm

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PDS360Q-13 - Diodes Incorporated PCB footprint - Other - Other - PDS360Q-13
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PDS360Q-13 - Diodes Incorporated  - 3D model - Other - PDS360Q-13
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PDS360Q-13 Details

  • Manufacturer Part Number:

    PDS360Q-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC, POWERDI5, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY, FREE WHEELING DIODE, LOW POWER LOSS, LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.76 V

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    150 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PDS360Q-13 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The PDS360Q-13 has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent ESD damage. Additionally, consider adding external ESD protection devices if the application requires it.
  • Yes, the PDS360Q-13 is designed to handle high currents, but it's crucial to ensure the device is properly heat-sinked and the PCB is designed to handle the high current. Also, consider the maximum current rating and power dissipation to avoid overheating.
  • To troubleshoot issues with the PDS360Q-13, start by checking the power supply voltage, input/output connections, and PCB layout. Use a multimeter to measure voltage and current, and consider using a thermal imaging camera to identify thermal issues.

Trust Checks

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PDS360Q-13 Overview

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