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PDS560-13 - Diodes Incorporated

Description: Diodes Inc PDS560-13, SMT Schottky Diode, 60V 5A, 3-Pin PowerDI 5

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PDS560-13 - Diodes Incorporated PCB footprint - Other - Other - PDS560-13
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PDS560-13 - Diodes Incorporated  - 3D model - Other - PDS560-13
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PDS560-13 Details

  • Manufacturer Part Number:

    PDS560-13

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC, POWERDI 5, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    POWERDI 5

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT, LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    60 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.77 V

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    255

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

PDS560-13 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently and reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design guidelines, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The PDS560-13 has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and installation. Ensure that the device is handled in an ESD-controlled environment, and consider adding external ESD protection devices if necessary.
  • Yes, the PDS560-13 is designed to handle high currents. However, it's crucial to ensure that the device is properly heat-sunk and that the PCB is designed to handle the high currents. Additionally, consider the device's power rating and thermal limitations to avoid overheating.
  • The recommended soldering conditions for the PDS560-13 are a peak temperature of 260°C, with a soldering time of 10 seconds or less. It's essential to follow these conditions to avoid damaging the device.

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PDS560-13 Overview

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