CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, ensure a minimum of 10 mm clearance around the module for airflow and heat dissipation.
To ensure EMC, CUI recommends following proper PCB design and layout guidelines, using a metal enclosure, and implementing EMI filtering on the input and output lines. Additionally, ensure that the module is installed in a way that minimizes radiation and conduction of electromagnetic interference.
The derating curve for the PDSE1-S12-S5-S is available upon request from CUI. In general, the module's output power will decrease as the temperature increases. For example, at 50°C, the module's output power may be derated by 10-15% to ensure reliable operation.
Yes, the PDSE1-S12-S5-S can be used in a redundant or parallel configuration. However, CUI recommends consulting with their application engineers to ensure proper design and implementation to avoid any potential issues with synchronization, noise, or stability.
The PDSE1-S12-S5-S has various agency approvals and certifications, including UL, cUL, CE, and RoHS. CUI can provide certifications for different regions upon request. Please consult with their sales team for specific certification requirements.
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PDSE1-S12-S5-S Overview
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